Advanced Avionics & Electronics Solutions for Aircraft Manufacturers
FEATURED PRODUCTS
LCA-24
Electrically conductive epoxy
LCA-4
Low expansion adhesive for hermetic sealing of metal, ceramic, and glass
LCA-9
Low expansion adhesive for aluminum and beryllium
Flexobond 442
Urethane encapsulant with high thermal conductivity and low out-gassing
Why H.B. Fuller for Avionics Adhesives
and Sealants?
• Thermal and Electrical Conductivity: Manage heat dissipation and signal integrity in high-density electronic assemblies.
• Low Outgassing & Flame Retardancy: Ideal for sensitive avionics and space applications.
• Conformal Coatings: Protect printed circuit boards from moisture, corrosion, and environmental stress.
• Lightweight, Rapid-Cure Adhesives: Reduce assembly time and aircraft weight without compromising strength.
• High Impact and Chemical Resistance: Ensure long-term durability in extreme aerospace environments.
These materials are designed for use in cockpit electronics, flight control modules, radar systems, and satellite communications—where performance and reliability are non-negotiable.
Electronics Capabilities That Power the Future of Flight
• Low-Temperature, Fast-Cure Liquids: Ideal for board- and component-level bonding in compact, high-performance systems.
• Light-Cure and UV-Cure Adhesives: Enable rapid processing and precision placement in automated manufacturing environments.
• Reactive Hot Melts and 2K Liquids: Deliver strong, flexible bonds for vibration-prone aerospace assemblies.
• Thermal Management Materials: Enhance heat dissipation in power electronics and avionics enclosures.
• Silicone and Polyurethane Systems: Provide flexibility, environmental sealing, and long-term stability.
Board Level Materials for Avionics Electronic Assembly
H.B. Fuller delivers cutting-edge board-level adhesive technologies designed to meet the rigorous demands of avionics and electronic assemblies. Our specialized portfolio enhances reliability, performance, and protection across a wide range of applications. From conformal coatings that shield printed circuit boards against moisture and contaminants, to die attach adhesives that ensure secure chip bonding, our solutions are engineered for precision and durability.
We also offer electrically conductive adhesives for efficient signal transmission, encapsulants and potting compounds for robust environmental protection, and edgebonding techniques that reinforce structural integrity. Our underfill materials strengthen solder joints and prevent chip movement, while thermally conductive materials (TIMs) enable effective heat dissipation for optimal performance. With H.B. Fuller, customers gain access to a comprehensive suite of adhesives tailored for the future of avionics electronics.
- Conformal Coating
- Die Attach
- Edgebond
- Underfill
- Electrically conductive Adhesive
- Encapsulants
- Potting
- Thermally Conductive Material (TIM)
These technologies are engineered to meet the demands of next-generation aerospace platforms, including electric aircraft, UAVs, and space systems.
Partnering with Aircraft Manufacturers for Performance and Progress
Whether you're building commercial airliners, military jets, or space vehicles, H.B. Fuller is your partner in innovation. Our global technical support, custom formulation capabilities, and aerospace-qualified materials help you accelerate development, streamline production, and meet the highest standards of safety and performance.
