Automotive Electronics Adhesives

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Our automotive electronics adhesives are targeted towards high-performance bonding applications for a wide variety of assembly applications throughout the vehicle including Advanced Driver Assist Systems (ADAS), video screens, engine-control computers, power steering and braking, lighting controls, and keyless entry.

As an automotive electronics manufacturer, you want to be confident that you’re providing superior products that are poised to meet growth, and that help make driving an all-around safer, more enjoyable experience. From state-of-the-art cameras and radar emergence to lane departure and autonomous cruise control, you understand best how these electronic systems work together to identify objects and potential hazards for the drivers to help keep them safe on the road.

You also want to be sure that you’re staying on top of emerging automotive electronics adhesive design trends so that your products address consumer demand, some of which include environmental friendliness, high performance, lightweighting, compatibility, connectivity, and safety. Following are some of our capabilities regarding each of the emerging trends.


  • Environmental Friendliness: we utilize renewable materials made from natural or synthetically produced products, and that are biocompatible to ensure no adverse effects will occur.

  • High Performance: we increase the bond strength and environmental stability, enabling us to reduce the overall bond area with outstanding durability and to pass rigorous reliability testing standards.

  • Lightweighting: we help save weight by gluing and using various substrates that lead to lower overall mass.

  • Compatibility: we use low curing temp and alternative curing methods such as UV to avoid the damage of substrates and components and ensure compatibility with customer processes and many substrates (including CTE issues).

  • Connectivity: we enable and enhance a variety of integrated solutions as vehicles continue to increase connectivity with more devices and networks, and as visual data collection and communications technologies improve.

  • Safety: we help enhance safety with an integration of superior electronics that are capable of observing and reporting statuses, including lane monitoring and autonomous driving.

We’re excited about the potential for advanced automotive electronics and the impact it will have on the overall driving experience. Contact an H.B. Fuller expert today to learn more about state-of-the-art automotive electronics adhesives of the future.

EA6031

  • Excellent plastic
  • PVC and PC bonding
  • Good gap flow
  • Viscosity: 300 cps
Technologie Documentation
EA6031
Used For adhesion to plastics, metals and glass
UV Cure | UV Material

EA6032

  • Excellent plastic
  • PVC and PC bonding
  • Viscosity: 3,000 cps
Technologie Documentation
EA6032
Used For adhesion to plastics, metals and glass
UV Cure | UV Material

EA6033

  • Flexible and excellent plastic, PVC and PC bonding
  • Viscosity: 11,000 cps
Technologie Documentation
EA6033
Used For flexible and high adhesion on fpcb
UV Cure | UV Material

EA6034

  • FPC reinforcement
  • Rigid material
  • Tacky free
  • Viscosity: 12,000 cps
Technologie Documentation
EA6034
Used For fpcb reinforcement
UV Cure | UV Material

EA6035

  • Non-yellowing
  • High bonding strength for plastic
  • Viscosity: 4,000 cps
Technologie Documentation
EA6035
Used For fpcb reinforcement
UV Cure | UV Material

EA6037

  • Electronics component reinforcement
  • Excellent adhesion on a wide range of materials
  • Viscosity: 20,000 cps
Technologie Documentation
EA6037
Used For component reinforcement fpcb reinforcement
UV Cure | UV Material

EA6053H

  • Designed for rubber ring replacement
  • Soft material, Tacky free after cured
  • Viscosity: 30,000 cps, TI: 3
  • 7
Technologie Documentation
EA6053H
Used For rubber ring replacement
UV Cure | UV Material

EA6056

  • Designed for waterproof application
  • Soft material after cured
  • Tacky surface enhance sealant performance
  • Viscosity: 68,000 cps, TI: 4
  • 7
Technologie Documentation
EA6056
Used For waterproof sealant
UV Cure | UV Material

EA6107

  • UV/moisture cure conformal coating material
  • Medium viscosity
  • Viscosity: 10,500 cps
Technologie Documentation
EA6107
Used For pcb coating
UV Material | UV Moisture Cure

EA6110

  • Designed for circuit board protection
  • Viscosity: 800 cps
Technologie Documentation
EA6110
Used For pcb coating
UV Material | UV Moisture Cure

EA6111

  • Designed for circuit board protection
  • Low viscosity
  • Viscosity: 200 cps
Technologie Documentation
EA6111
Used For pcb coating
UV Material | UV Moisture Cure

EA6201

  • Excellent bonding perfromance
  • Shardow area cured by anaerobic
  • Viscosity: 18,000 cps
Technologie Documentation
EA6201
Used For adhesion to glass and metals anaerobic cure
UV Cure | UV Material

EA6202

  • Excellent glass and metal bonding performance
  • Viscosity: 4,000 cps
Technologie Documentation
EA6202
Used For adhesion to glass and metals
UV Cure | UV Material

EA6203

  • Excellent glass and metal bonding perfromance
  • Viscosity: 8,500 cps
Technologie Documentation
EA6203
Used For adhesion to glass and metals
UV Cure | UV Material

EA6204

  • Designed for TN/STN end seal application
  • Viscosity: 10,000 cps
Technologie Documentation
EA6204
Used For adhesion to glass and metals tn/stn end seal
UV Cure | UV Material

EA6205

  • Designed for TN/STN metal pin sealant
  • Viscosity: 7,000 cps
Technologie Documentation
EA6205
Used For adhesion to glass and metals tn/stn metal pin sealant
UV Cure | UV Material

EA6206

  • Designed for TN/STN metal pin sealant
  • Viscosity: 14,000 cps
Technologie Documentation
EA6206
Used For adhesion to glass and metals tn/stn metal pin sealant
UV Cure | UV Material

EA6402M

  • Designed for ISA (image sensor assembly) AA process
  • Black color
  • Dual cure system
  • UV plus low temperature cure (80℃)
  • Good initial strength by UV
  • High thermal bonding trength to LCP
  • Low shrinkage
  • Viscosity: 45,800 cps
Technologie Documentation
EA6402M
Used For aa process isa (image sensor assembly)
UV Material | UV Thermal Cure

EA6405

  • Designed for ISA (image sensor assembly) AA process
  • Beige color
  • Dual cure system
  • UV plus low temperature cure (65℃)
  • Good initial strength by UV
  • Low shrinkageViscosity: 48,000 cps
Technologie Documentation
EA6405
Used For aa process isa (image sensor assembly)
UV Material | UV Thermal Cure

EH9641

  • Ultra fast curing speed
Technologie Documentation
EH9641
Used For accessories assembly cell phone touch panel bonding structure assembly
Reactive Hotmelt | RHM

EH9650

  • General purpose
  • Excellent adhesion on most substrates
  • Capable of narrow edge bonding
Technologie Documentation
EH9650
Used For accessories assembly cell phone touch panel bonding structure assembly
Reactive Hotmelt | RHM

EH9651B

  • Black color
  • Excellent adhesion on most substrates
  • Capable of narrow edge bonding
Technologie Documentation
EH9651B
Used For cell phone touch panel bonding
Reactive Hotmelt | RHM

EH9652

  • Excellent adhesion on PET, ABS and etc
  • High bonding strength
  • Capable of narrow edge bonding
Technologie Documentation
EH9652
Used For accessories assembly cell phone touch panel bonding structure assembly
Reactive Hotmelt | RHM

EH9672

  • High reliability and excellent reworkability
  • Excellent adhesion on most substrates
  • Long open time
Technologie Documentation
EH9672
Used For accessories assembly structure assembly tablet touch panel bonding
Reactive Hotmelt | RHM

EM9002

  • Low activation temperature
  • High strength and elongation
  • Good heat resistance
  • Good chemical resistance
  • Color: milky white
  • Recommended substrates: plastic, textiles - leather
  • Tacking temperature (°C): 45-55
  • Typical peel strength on polycarbonate
Technologie Documentation
EM9002
Used For leather plastic textiles
Film | Reactive film adhesive

EP702 (FH8516)

  • Room temperature curing epoxy adhesive
  • Designed for high strength
  • Good flexibility and good impact strength after curing
  • Good bonding performane on variable substrates including composite, metal, glass, ceramic
Technologie Documentation
EP702 (FH8516)
Used For structure bonding
2k Epoxy | 2K Epoxy

EU2002

  • Low odor
  • Excellent mech and chem resistance
Technologie Documentation
EU2002
Used For conformal coating
Solvent Base Modified Alkyd | Solvent-based

EU2002HV

  • Low odor
  • Excellent mech and chem resistance
  • High viscosity
Technologie Documentation
EU2002HV
Used For conformal coating
Solvent Base Modified Alkyd | Solvent-based

FH1007

  • Fast curing speed
  • Suitable for assembly application
  • It can be used in different substrates, such as metal, glass and most plastics
Technologie Documentation
FH1007
Used For moisture cure
Modifed Silicone | Modified silicone

FH1280AB

  • Compatible and good adhesion with Parylene
  • Excellent point and sharp edge coverage
  • Excellent mech and chem resistance
Technologie Documentation
FH1280AB
Used For conformal coating
2K PU | 2K PU

FH3911AB

  • Water/optically clear Low outgassing
Technologie Documentation
FH3911AB
Used For potting
2K Urethane | Urethane

FH4008AB

  • Excellent isolation resistance
  • Very low moisture absorption
  • Resistant to age hardening
  • Very high dielectric strength
  • High service temperature
Technologie Documentation
FH4008AB
Used For potting
2K Epoxy | Epoxy

FH7006FR

  • Excellent bonding performance on most substrates
  • Flammable retardant UL 94 V0
Technologie Documentation
FH7006FR
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7011

  • Metal structure bonding adhesive
Technologie Documentation
FH7011
Used For structure bonding
1K Acrylate | Acrylate

FH7012

  • Thermal conductivity adhesive
Technologie Documentation
FH7012
Used For heat sink attachment
Acrylate | TCA

FH7012S

  • Thermal conductivity adhesive with Spacer
Technologie Documentation
FH7012S
Used For heat sink attachment
Acrylate | TCA

FH7013

  • High strength and impact resistance
  • High temperature resistance
  • Suitable for most of substrates
Technologie Documentation
FH7013
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7015

  • High strength and impact resistance
  • Suitable for most of substrates
Technologie Documentation
FH7015
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7016

  • Designed for special metal surfaces
  • High strength and impact resistant
Technologie Documentation
FH7016
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7026

  • General purpose
  • High strength and impact resistance
  • Suitable for most of substrates
Technologie Documentation
FH7026
Used For structure bonding
2K Acrylate | 2K Acrylate

FH8009

  • Designed for high reliability portable devices
  • Fast flow performance
Technologie Documentation
FH8009
Used For underfill
Epoxy | Epoxy

FH8014

  • CSP/BGA high performance underfill
  • Very good reworkability
  • Substrate preheat is required
Technologie Documentation
FH8014
Used For underfill
Epoxy | Epoxy

FH8017M

  • Fast flow CSP underfill
  • Low temperature fast curing
  • Very good reworkability
Technologie Documentation
FH8017M
Used For underfill
Epoxy | Epoxy

FH8050

  • Designed for edge bonding application
  • Self-alignment in lead-free reflow
  • Good dispensing performance and shape retention
  • Capability in narrow edge CSP or WLCSP
Technologie Documentation
FH8050
Used For edge bonding
Epoxy | Epoxy

FH8301

  • Designed for Flipchip high reliability application
  • High Tg
  • Low CTE
  • High reliability
Technologie Documentation
FH8301
Used For underfill
Epoxy | Epoxy

FH8302

  • Designed for Flipchip high reliability application
  • High Tg
  • Low CTE
  • High reliability
  • High flowability
Technologie Documentation
FH8302
Used For underfill
Epoxy | Epoxy

FH8511

  • Excellent impact strength and toughness
  • Suitable for bonding most materials
  • Fast setting
Technologie Documentation
FH8511
Used For structure bonding
2k Epoxy | 2K Epoxy

FH8512

  • Medium fixture time
  • Suitable for most applications
Technologie Documentation
FH8512
Used For structure bonding
2k Epoxy | 2K Epoxy

FH8513

  • Designed for device assembly
  • Long open time
  • High reliability
  • High toughness
Technologie Documentation
FH8513
Used For structure bonding
2k Epoxy | 2K Epoxy

FH8515

  • Excellent impact strength and toughness
  • Suitable for bonding most materials
  • Flammable retardant UL 94 V0
  • Halogen free
Technologie Documentation
FH8515
Used For structure bonding
2k Epoxy | 2K Epoxy

FH8620

  • Low temperature and high bonding strength
  • Stencil printable
Technologie Documentation
FH8620
Used For structure bonding
Epoxy | LTCA

FH8621

  • Excellent toughness
  • Good jetting performance
  • Good bonding strength to PA and LCP
Technologie Documentation
FH8621
Used For image sensor house attachment
Epoxy | LTCA

FH8623

  • High performance material
  • Ultra fast curing
  • High toughness
  • Low shrinkage
Technologie Documentation
FH8623
Used For structure bonding
Epoxy | LTCA

FH8708T

  • Good dispensing performance and shape retention
  • Low CTE
  • Good reliability
Technologie Documentation
FH8708T
Used For edge bonding
Epoxy | Epoxy

FH8731

  • Designed for wirebond chip glob top
  • High flow material
Technologie Documentation
FH8731
Used For cob
Epoxy | Epoxy

FH8800

  • Optically clear bonding or LED die attach
Technologie Documentation
FH8800
Used For die attach potting or bonding
Epoxy | Epoxy

FH8801C

  • High electrical conductivity
  • High bond strength
  • Low stress
  • High Tg, Low CTE
  • Fast
  • Low temperature cure
  • Low outgassing
Technologie Documentation
FH8801C
Used For conductive die attach
Acrylate | ECA

FS3000

  • Good dielectric properties
  • Corrosion-free to metals
Technologie Documentation
FS3000
Used For conformal coating
1K silicone | Silicone

RFA1005

  • Excellent adhesion to metals
  • Low activation temperature
  • Color: milky white
  • Recommended substrates: stainless steel, aluminum, plastics, textiles, leather
  • Tacking temperature (°C): 45-55
  • Typical peel strength on polycarbonate (N/25 mm): 70-75
  • Typ
Technologie Documentation
RFA1005
Used For aluminum leather plastics stainless steel textiles
Film | Reactive film adhesive

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