Clean Melt®

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Clean Melt® Hot Melt Packaging Adhesives

Clean Melt® packaging adhesives are a family of high-performance, value-added hot melts developed with our proprietary clean adhesive technology. These solutions combine high mileage, low maintenance, and powerful productivity with robust adhesion to create exceptional value.


Clean Adhesive Technology Features and Benefits

  • Maintains consistent light color
  • Odor free
  • Resists viscosity gain
  • Performs without stringing and tailing
  • Resists gel and char
  • Applies in precise intermittent (stitch) pattern 
  • Enhanced appearance of packages
  • User-friendly working environment
  • Consistent application, more mileage
  • Better looking packages and less downtime for maintenance
  • Fewer blocked filters and nozzles, less waste and downtime, higher machine efficiency
  •  More mileage and enhanced appearance of packages 

High Performance Bonding Features and Benefits

  • Resists bond failure at either low or high service temperatures
  • Adheres to many difficult substrates
  • Bonds with few, precise beads placed
  • Reduces waste, product returns and replacement costs
  • Fewer adhesives needed, less downtime for changing adhesives
  • More mileage and compatibility with innovative adhesive application machines 
Technology Documentation
Clean Melt® PHC 7005
Used for Cases that are on fast setting lines using low applications temperatures
Hot Melt

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