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Thermally-conductive
adhesive materials

Electric vehicle batteries present an ever-increasing demand for thermal management solutions. 

To ensure optimal battery performance over the life of the vehicle, good thermal management design is critical. Bonding to cold plates is our specialty. Our comprehensive line of thermally conductive adhesives and silicone-free gap fillers provide excellent solutions to ever-increasing performance requirements. Our thermally conductive adhesives provide for excellent adhesion to a variety of materials like Nickel and Aluminum- commonly found in battery modules. These thermally-conductive materials help facilitate the efficient transmission of heat away from critical circuits and connection points.

EY5005

  • Thermally conductive epoxy for cell bonding to cold plate, 5 minute
Technology Documentation
EY5005
Used for bonding nickel to aluminum
Epoxy | Thermal Adhesive

EY5020

  • Thermally conductive epoxy for cell bonding to cold plate, 20 minute
Technology Documentation
EY5020
Used for bonding nickel to aluminum
Epoxy | Thermal Adhesive

EY5060

  • Thermally conductive epoxy for cell bonding to cold plate, 60 minute
Technology Documentation
EY5060
Used for bonding nickel to aluminum
Epoxy | Thermal Adhesive

EY5090

  • Thermally conductive epoxy for cell bonding to cold plate, 90 minute
Technology Documentation
EY5090
Used for bonding nickel to aluminum
Epoxy | Thermal Adhesive

Körapop EP38168-064

  • Silicone free thermally condictive gap fillers
  • Mixing ratio 10:1
  • Thermal conductivity 4
  • 6 W/m*K
Technology Documentation
Körapop EP38168-064
Used for thermally conductive gap filling
Gap filler | MS Polymer

Körapop EP38168-124

  • Silicone free thermally condictive gap fillers
  • Mixing ratio 1:1
  • Thermal conductivity 3 W/m*K
Technology Documentation
Körapop EP38168-124
Used for thermally conductive gap filling
Gap filler | MS Polymer

Körapop EP40624

  • Thermally conductive structural adhesive with resistance to Glycol to bond cooling plates
Technology Documentation
Körapop EP40624
Used for thermally conductive structural adhesive
Gap filler | MS Polymer

TS820FR

  • Flame retardant, low odor, excellent shear and peel strength
  • Thermally conductive acrylate for cell bonding to cold plate
Technology Documentation
TS820FR
Used for bonding nickel to aluminum suitable for metals and ceramics bonding quickly with minimal surface preparation
Anaerobic | Anaerobic | MMA | Thermal Adhesive

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