Automotive Electronics Adhesives
Our automotive electronics adhesives are targeted towards high-performance bonding applications for a wide variety of assembly applications throughout the vehicle including Advanced Driver Assist Systems (ADAS), video screens, engine-control computers, power steering and braking, lighting controls, and keyless entry.
As an automotive electronics manufacturer, you want to be confident that you’re providing superior products that are poised to meet growth, and that help make driving an all-around safer, more enjoyable experience. From state-of-the-art cameras and radar emergence to lane departure and autonomous cruise control, you understand best how these electronic systems work together to identify objects and potential hazards for the drivers to help keep them safe on the road.
You also want to be sure that you’re staying on top of emerging automotive electronics adhesive design trends so that your products address consumer demand, some of which include environmental friendliness, high performance, lightweighting, compatibility, connectivity, and safety. Following are some of our capabilities regarding each of the emerging trends.
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Environmental Friendliness: we utilize renewable materials made from natural or synthetically produced products, and that are biocompatible to ensure no adverse effects will occur.
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High Performance: we increase the bond strength and environmental stability, enabling us to reduce the overall bond area with outstanding durability and to pass rigorous reliability testing standards.
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Lightweighting: we help save weight by gluing and using various substrates that lead to lower overall mass.
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Compatibility: we use low curing temp and alternative curing methods such as UV to avoid the damage of substrates and components and ensure compatibility with customer processes and many substrates (including CTE issues).
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Connectivity: we enable and enhance a variety of integrated solutions as vehicles continue to increase connectivity with more devices and networks, and as visual data collection and communications technologies improve.
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Safety: we help enhance safety with an integration of superior electronics that are capable of observing and reporting statuses, including lane monitoring and autonomous driving.
We’re excited about the potential for advanced automotive electronics and the impact it will have on the overall driving experience. Contact an H.B. Fuller expert today to learn more about state-of-the-art automotive electronics adhesives of the future.
Our Featured Automotive Electronics Adhesives Products
EA6031
- Excellent plastic
- PVC and PC bonding
- Good gap flow
- Viscosity: 300 cps
- UV Cure Acrylic for Bonding PC Plastic Cell Carrier
Technology | Documentation | |
---|---|---|
EA6031Used for adhesion to plastics, metals and glass uv curable adhesive |
TechnologyAcrylic | UV Cure | UV Cure | UV Moisture Cure |
EA6032
- Excellent plastic
- PVC and PC bonding
- Viscosity: 3,000 cps
Technology | Documentation | |
---|---|---|
EA6032Used for adhesion to plastics, metals and glass |
TechnologyUV Cure | UV Moisture Cure |
EA6033
- Flexible and excellent plastic, PVC and PC bonding
- Viscosity: 11,000 cps
- 1 part PU UV cure bonding a wide variety of substrates
- This product has shown excellent adhesion and flexible
- It can be used for BGA reinforcement
Technology | Documentation | |
---|---|---|
EA6033Used for flexible and high adhesion on fpcb high quality uv cure adhesive for general bonding |
TechnologyAcrylic | UV Cure | UV Cure | UV Moisture Cure |
EA6034
- FPC reinforcement
- Rigid material
- Tacky free
- Viscosity: 12,000 cps
Technology | Documentation | |
---|---|---|
EA6034Used for fpcb reinforcement |
TechnologyUV Cure | UV Moisture Cure |
EA6035
- Non-yellowing
- High bonding strength for plastic
- Viscosity: 4,000 cps
Technology | Documentation | |
---|---|---|
EA6035Used for fpcb reinforcement |
TechnologyUV Cure | UV Moisture Cure |
EA6037
- Electronics component reinforcement
- Excellent adhesion on a wide range of materials
- Viscosity: 20,000 cps
Technology | Documentation | |
---|---|---|
EA6037Used for component reinforcement fpcb reinforcement |
TechnologyUV Cure | UV Moisture Cure |
EA6053H
- Designed for rubber ring replacement
- Soft material, Tacky free after cured
- Viscosity: 30,000 cps, TI: 3
Technology | Documentation | |
---|---|---|
EA6053HUsed for rubber ring replacement |
TechnologyUV Cure | UV Moisture Cure |
EA6056
- Designed for waterproof application
- Soft material after cured
- Tacky surface enhance sealant performance
- Viscosity: 68,000 cps, TI: 4
Technology | Documentation | |
---|---|---|
EA6056Used for waterproof sealant |
TechnologyUV Cure | UV Moisture Cure |
EA6107
- UV/moisture cure conformal coating material
- Medium viscosity
- Viscosity: 10,500 cps
Technology | Documentation | |
---|---|---|
EA6107Used for pcb coating |
TechnologyUV Material | UV Moisture Cure |
EA6110
- Designed for circuit board protection
- Viscosity: 800 cps
Technology | Documentation | |
---|---|---|
EA6110Used for pcb coating |
TechnologyUV Material | UV Moisture Cure |
EA6111
- Designed for circuit board protection
- Low viscosity
- Viscosity: 200 cps
Technology | Documentation | |
---|---|---|
EA6111Used for pcb coating |
TechnologyUV Material | UV Moisture Cure |
EA6201
- Excellent bonding perfromance
- Shardow area cured by anaerobic
- Viscosity: 18,000 cps
Technology | Documentation | |
---|---|---|
EA6201Used for adhesion to glass and metals anaerobic cure |
TechnologyUV Cure | UV Moisture Cure |
EA6202
- Excellent glass and metal bonding performance
- Viscosity: 4,000 cps
Technology | Documentation | |
---|---|---|
EA6202Used for adhesion to glass and metals |
TechnologyUV Cure | UV Moisture Cure |
EA6203
- Excellent glass and metal bonding perfromance
- Viscosity: 8,500 cps
Technology | Documentation | |
---|---|---|
EA6203Used for adhesion to glass and metals |
TechnologyUV Cure | UV Moisture Cure |
EA6204
- Designed for TN/STN end seal application
- Viscosity: 10,000 cps
Technology | Documentation | |
---|---|---|
EA6204Used for adhesion to glass and metals tn/stn end seal |
TechnologyUV Cure | UV Moisture Cure |
EA6205
- Designed for TN/STN metal pin sealant
- Viscosity: 7,000 cps
Technology | Documentation | |
---|---|---|
EA6205Used for adhesion to glass and metals tn/stn metal pin sealant |
TechnologyUV Cure | UV Moisture Cure |
EA6206
- Designed for TN/STN metal pin sealant
- Viscosity: 14,000 cps
Technology | Documentation | |
---|---|---|
EA6206Used for adhesion to glass and metals tn/stn metal pin sealant |
TechnologyUV Cure | UV Moisture Cure |
EA6402M
- Designed for ISA (image sensor assembly) AA process
- Black color
- Dual cure system
- UV plus low temperature cure (80℃)
- Good initial strength by UV
- High thermal bonding trength to LCP
- Low shrinkage
- Viscosity: 45,800 cps
Technology | Documentation | |
---|---|---|
EA6402MUsed for aa process isa (image sensor assembly) |
TechnologyUV Material | UV Thermal Cure |
EA6405
- Designed for ISA (image sensor assembly) AA process
- Beige color
- Dual cure system
- UV plus low temperature cure (65℃)
- Good initial strength by UV
- Low shrinkageViscosity: 48,000 cps
Technology | Documentation | |
---|---|---|
EA6405Used for aa process isa (image sensor assembly) |
TechnologyUV Material | UV Thermal Cure |
EH9641
- Ultra fast curing speed
Technology | Documentation | |
---|---|---|
EH9641Used for accessories assembly cell phone touch panel bonding structure assembly |
TechnologyReactive Hotmelt | RHM |
EH9650
- General purpose
- Excellent adhesion on most substrates
- Capable of narrow edge bonding
- Hot Melt excellent adhesion on most substrates without primer
Technology | Documentation | |
---|---|---|
EH9650Used for accessories assembly cell phone touch panel bonding reactive hotmelt with excellent adhesion on most substrates structure assembly |
TechnologyReactive Hotmelt | RHM | RHM |
EH9651B
- Black color
- Excellent adhesion on most substrates
- Capable of narrow edge bonding
Technology | Documentation | |
---|---|---|
EH9651BUsed for cell phone touch panel bonding |
TechnologyReactive Hotmelt | RHM |
EH9652
- Excellent adhesion on PET, ABS and etc
- High bonding strength
- Capable of narrow edge bonding
Technology | Documentation | |
---|---|---|
EH9652Used for accessories assembly cell phone touch panel bonding structure assembly |
TechnologyReactive Hotmelt | RHM |
EH9672
- High reliability and excellent reworkability
- Excellent adhesion on most substrates
- Long open time
Technology | Documentation | |
---|---|---|
EH9672Used for accessories assembly structure assembly tablet touch panel bonding |
TechnologyReactive Hotmelt | RHM |
EM9002
- Low activation temperature
- High strength and elongation
- Good heat resistance
- Good chemical resistance
- Color: milky white
- Recommended substrates: plastic, textiles - leather
- Tacking temperature (°C): 45-55
- Typical peel strength on polycarbonate
Technology | Documentation | |
---|---|---|
EM9002Used for leather plastic textiles |
TechnologyFilm | Reactive film adhesive |
EP702 (FH8516)
- Room temperature curing epoxy adhesive
- Designed for high strength
- Good flexibility and good impact strength after curing
- Good bonding performane on variable substrates including composite, metal, glass, ceramic
Technology | Documentation | |
---|---|---|
EP702 (FH8516)Used for structure bonding |
Technology2k Epoxy | 2k Epoxy |
EU2002
- Low odor
- Excellent mech and chem resistance
Technology | Documentation | |
---|---|---|
EU2002Used for conformal coating |
TechnologySolvent Base Modified Alkyd | Solvent-based |
EU2002HV
- Low odor
- Excellent mech and chem resistance
- High viscosity
Technology | Documentation | |
---|---|---|
EU2002HVUsed for conformal coating |
TechnologySolvent Base Modified Alkyd | Solvent-based |
FH1007
- Fast curing speed
- Suitable for assembly application
- It can be used in different substrates, such as metal, glass and most plastics
Technology | Documentation | |
---|---|---|
FH1007Used for moisture cure |
TechnologyModified silicone | Modified silicone |
FH1280AB
- Compatible and good adhesion with Parylene
- Excellent point and sharp edge coverage
- Excellent mech and chem resistance
Technology | Documentation | |
---|---|---|
FH1280ABUsed for conformal coating |
Technology2K PU | 2K PU |
FH3911AB
- Water/optically clear Low outgassing
Technology | Documentation | |
---|---|---|
FH3911ABUsed for potting |
Technology2K Urethane | Urethane |
FH4008AB
- Excellent isolation resistance
- Very low moisture absorption
- Resistant to age hardening
- Very high dielectric strength
- High service temperature
Technology | Documentation | |
---|---|---|
FH4008ABUsed for potting |
Technology2k Epoxy | Epoxy |
FH7006FR
- Excellent bonding performance on most substrates
- Flammable retardant UL 94 V0
Technology | Documentation | |
---|---|---|
FH7006FRUsed for structure bonding |
Technology2K Acrylate | 2K Acrylate |
FH7011
- Metal structure bonding adhesive
- 1 part acrylic anaerobic-Bonding ferrites to electro-plated materials in electric motors
Technology | Documentation | |
---|---|---|
FH7011Used for anaerobic adhesive for electric motor bonding structure bonding |
Technology1K Acrylate | Acrylate | Anaerobic | Anaerobic |
FH7012
- Thermal conductivity adhesive
Technology | Documentation | |
---|---|---|
FH7012Used for heat sink attachment |
TechnologyAcrylate | TCA |
FH7012S
- Thermal conductivity adhesive with Spacer
Technology | Documentation | |
---|---|---|
FH7012SUsed for heat sink attachment |
TechnologyAcrylate | TCA |
FH7013
- High strength and impact resistance
- High temperature resistance
- Suitable for most of substrates
Technology | Documentation | |
---|---|---|
FH7013Used for structure bonding |
Technology2K Acrylate | 2K Acrylate |
FH7015
- High strength and impact resistance
- Suitable for most of substrates
Technology | Documentation | |
---|---|---|
FH7015Used for structure bonding |
Technology2K Acrylate | 2K Acrylate |
FH7016
- Designed for special metal surfaces
- High strength and impact resistant
Technology | Documentation | |
---|---|---|
FH7016Used for structure bonding |
Technology2K Acrylate | 2K Acrylate |
FH7026
- General purpose
- High strength and impact resistance
- Suitable for most of substrates
Technology | Documentation | |
---|---|---|
FH7026Used for structure bonding |
Technology2K Acrylate | 2K Acrylate |
FH8009
- Designed for high reliability portable devices
- Fast flow performance
Technology | Documentation | |
---|---|---|
FH8009Used for underfill |
TechnologyEpoxy | Epoxy |
FH8014
- CSP/BGA high performance underfill
- Very good reworkability
- Substrate preheat is required
Technology | Documentation | |
---|---|---|
FH8014Used for underfill |
TechnologyEpoxy | Epoxy |
FH8017M
- Fast flow CSP underfill
- Low temperature fast curing
- Very good reworkability
Technology | Documentation | |
---|---|---|
FH8017MUsed for underfill |
TechnologyEpoxy | Epoxy |
FH8050
- Designed for edge bonding application
- Self-alignment in lead-free reflow
- Good dispensing performance and shape retention
- Capability in narrow edge CSP or WLCSP
Technology | Documentation | |
---|---|---|
FH8050Used for edge bonding |
TechnologyEpoxy | Epoxy |
FH8301
- Designed for Flipchip high reliability application
- High Tg
- Low CTE
- High reliability
Technology | Documentation | |
---|---|---|
FH8301Used for underfill |
TechnologyEpoxy | Epoxy |
FH8302
- Designed for Flipchip high reliability application
- High Tg
- Low CTE
- High reliability
- High flowability
Technology | Documentation | |
---|---|---|
FH8302Used for underfill |
TechnologyEpoxy | Epoxy |
FH8511
- Excellent impact strength and toughness
- Suitable for bonding most materials
- Fast setting
Technology | Documentation | |
---|---|---|
FH8511Used for structure bonding |
Technology2k Epoxy | 2k Epoxy |
FH8512
- Medium fixture time
- Suitable for most applications
Technology | Documentation | |
---|---|---|
FH8512Used for structure bonding |
Technology2k Epoxy | 2k Epoxy |
FH8513
- Designed for device assembly
- Long open time
- High reliability
- High toughness
Technology | Documentation | |
---|---|---|
FH8513Used for structure bonding |
Technology2k Epoxy | 2k Epoxy |
FH8515
- Excellent impact strength and toughness
- Suitable for bonding most materials
- Flammable retardant UL 94 V0
- Halogen free
Technology | Documentation | |
---|---|---|
FH8515Used for structure bonding |
Technology2k Epoxy | 2k Epoxy |
FH8620
- Low temperature and high bonding strength
- Stencil printable
Technology | Documentation | |
---|---|---|
FH8620Used for structure bonding |
TechnologyEpoxy | LTCA |
FH8621
- Excellent toughness
- Good jetting performance
- Good bonding strength to PA and LCP
Technology | Documentation | |
---|---|---|
FH8621Used for image sensor house attachment |
TechnologyEpoxy | LTCA |
FH8623
- High performance material
- Ultra fast curing
- High toughness
- Low shrinkage
Technology | Documentation | |
---|---|---|
FH8623Used for structure bonding |
TechnologyEpoxy | LTCA |
FH8708T
- Good dispensing performance and shape retention
- Low CTE
- Good reliability
Technology | Documentation | |
---|---|---|
FH8708TUsed for edge bonding |
TechnologyEpoxy | Epoxy |
FH8731
- Designed for wirebond chip glob top
- High flow material
Technology | Documentation | |
---|---|---|
FH8731Used for cob |
TechnologyEpoxy | Epoxy |
FH8800
- Optically clear bonding or LED die attach
Technology | Documentation | |
---|---|---|
FH8800Used for die attach potting or bonding |
TechnologyEpoxy | Epoxy |
FH8801C
- High electrical conductivity
- High bond strength
- Low stress
- High Tg, Low CTE
- Fast
- Low temperature cure
- Low outgassing
- 1 part acrylate electrically conductive adhesive that cures by heat
- Fast curing at low temperatures with outstanding bond strength
- Used for chip bonding in microelectronic MEMS and optoelectronic applications
- This material is able to snap cure during
Technology | Documentation | |
---|---|---|
FH8801CUsed for conductive die attach fast curing chip bonding adhesive |
TechnologyAcrylate | Acrylic | ECA |
FS3000
- Good dielectric properties
- Corrosion-free to metals
Technology | Documentation | |
---|---|---|
FS3000Used for conformal coating |
Technology1K silicone | Silicone |
RFA1005
- Excellent adhesion to metals
- Low activation temperature
- Color: milky white
- Recommended substrates: stainless steel, aluminum, plastics, textiles, leather
- Tacking temperature (°C): 45-55
- Typical peel strength on polycarbonate (N/25 mm): 70-75
- Typ
Technology | Documentation | |
---|---|---|
RFA1005Used for aluminum leather plastics stainless steel textiles |
TechnologyFilm | Reactive film adhesive |
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