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Space ship in space

Adhesives for Space Exploration

Space Exploration

 

At H.B. Fuller, we have a deep understanding of the diverse requirements, challenges and severe conditions seen in space exploration. Given the extreme atmospheric conditions, products must support low outgassing, high conductivity, and high reliability in application — never failing, not even once. Our diverse portfolio of cutting-edge sealants and adhesives are proven to perform. But we pride ourselves on doing more than providing products — we partner with our customers and find solutions to help them explore the unknown.

 

Professional Grade Solutions for Extreme Environments

Manufacturing for space is a unique engineering challenge that demands ingenuity in every aspect of design. Outside of Earth’s atmosphere, each component of design must handle extreme heat, cold, and high-vacuum conditions without outgassing volatile byproducts that can damage surrounding circuitry. Our technology is proven to perform to industry standards and can provide unique formulations for these unforgiving conditions.

 

Thermally Conductive Solutions

 

Beyond high performance under pressure, H.B. Fuller products offer unique flexibility in design. With thermally conductive solutions, engineers have an alternative to soldering when attaching SMDs and can also use such adhesives to replace mechanical assembly. This process can ultimately save money, lower assembly weight, and reduce damage caused from vibration.

 

Polysulfides in Space

 

H.B. Fuller’s polysulfide sealants offer a variety of benefits in application: They have excellent low- and high-temperature performance, provide flexibility with their tensile and elongation properties, and can perform in real environmental conditions during assembly. Our lightweight and rapid cure variants also make them ideal for aircraft construction and repair whether you’re looking to ensure fuel containment, seal access doors, or protect equipment from corrosion.

 

Partner with Us in Exploring the Unknown

 

As a leading expert in adhesion technology, we continue to be the manufacturer of choice in expanding the limits of aerospace engineering and championing modern exploration. Our cutting-edge solutions and diverse portfolio cover both common and advanced applications for reliable, lightweight, and low VOC adhesives.

 

Contact us today to learn more.

EY3010

  • Will meet NASA limits for low volatile content
  • Extremely light weight
  • Self extinguishing flame retardant
  • Excellent chemical resistance
  • Excellent sag resistance even through powder coating processes
Technology Documentation
EY3010
Used for insert potting for honeycomb panels
Epoxy | Reactive Chemistry

LCA-4

  • Will meet NASA outgassing requirements
  • Gyro-grade
  • Excellent chemical resistence
  • Good dimensional stability
  • Low coefficient of thermal expansion
Technology Documentation
LCA-4
Used for hermetic sealing of metal ceramic glass and other substrates
Epoxy | Reactive Chemistry

P-182

  • Highly filled highperformance system
  • Low thermal expansion and excellent dimensional stability
  • Will meet NASA outgassing requirements
  • Non-magnetic
  • High strength high modulus
Technology Documentation
P-182
Used for high reliability high performance applications
Epoxy | Reactive Chemistry

Thermally Conductive 442

  • Thermally conductive and low outgassing
  • Suitable for bonding glass diodes or other stress sensitive components
  • Excellent electrical properties
  • High flexibility
Technology Documentation
Thermally Conductive 442
Used for circuit board assembly and protection
Polyurethane | Reactive Chemistry

WS-8033

  • General purpose sealeant
Technology Documentation
WS-8033
Used for general purpose sealing
Polysulfide

WS-8035 Class B

  • Lightweight rapidcure sealant
Technology Documentation
WS-8035 Class B
Used for fuel tank sealing
Polysulfide

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