Klebstoffe für Automobilelektronik

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Child looking on at automotive electronics in the front dash of a car. Global Adhesives Manufacturer Operating in Many Markets & Applications Innovative Adhesive Products and Solutions

Unsere Klebstoffe für Automobilelektronik sind für hocheffiziente Verklebungsanwendungen für viele verschiedene Anwendungen in Verbindung mit Fahrzeugen wie beispielsweise Advanced Driver Assist Systems (ADAS), Videobildschirme, Computer zur Motorsteuerung, Servolenkung und -bremsen, Beleuchtungssteuerungen und schlüssellosen Zugang bestimmt.

Als Hersteller von Automobilelektronik sind Sie daran interessiert, dass Sie immer hochwertige Produkte anbieten können, Wachstum ermöglichen und Autofahren zu einer komplett sicheren und attraktiven Erfahrung machen. Von hochmodernen Kameras und Radarverwendung bis zu Spurwechsel und autonomer Fahrtsteuerung wissen Sie am besten, wie diese elektronischen Systeme in Kombination Objekte und potenzielle Gefahren für die Fahrer erkennen, damit sie im Straßenverkehr immer sicher sind.

Außerdem möchten Sie sicher sein, dass Sie keine Trends im Bereich der Klebstoffe für die Automobilelektronik verpassen, damit Ihre Produkte den Kundenanforderungen entsprechen. Dies sind beispielsweise Umweltfreundlichkeit, hohe Leistung, geringes Gewicht, Kompatibilität, Konnektivität und Sicherheit. Es folgen einige unserer Angebote für die neuesten Trends.


  • Umweltfreundlichkeit: wir verwenden erneuerbares Material, das aus natürlichen oder synthetisch hergestellten Produkten hergestellt wird, die biokompatibel sind, damit kein nachteiligen Wirkungen auftreten.

  • Hohe Leistung: wir verbessern die Haftfestigkeit und die ökologische Stabilität, was uns ermöglicht, den gesamten Haftbereich mit hervorragender Beständigkeit zu verkleinern und hohe Standards bei den Tests der Zuverlässigkeit durchzusetzen.

  • Leicht: wir können Gewicht einsparen, indem wir verkleben und verschiedene Substrate verwenden, die leichter sind.

  • Kompatibel: wir arbeiten mit niedrigen Härtungstemperaturen und alternativen Härtungsmethoden wie UV, um Beschädigung von Substraten und Komponenten zu verhindern und Vereinbarkeit mit den Abläufen und vielen Substraten von Kunden zu gewährleiten (CTE eingeschlossen).

  • Konnektivität: wir ermöglichen und verbessern viele integrierte Lösungen, indem die Konnektivität von Fahrzeugen durch mehr Geräte und Fahrzeuge weiter erhöht und die Erfassung visueller Daten und Kommunikationstechnologien verbessert wird.

  • Sicherheit: wir helfen bei der Verbesserung der Sicherheit durch die Integration von hochwertiger Elektronik, mit deren Hilfe der jeweilige Status beobachtet und gemeldet werden kann, beispielsweise Spurüberwachung und autonomes Fahren.

Wir freuen uns über das Potenzial für hochentwickelte Automobilelektronik und die Wirkung, die sie auf die allgemeine Fahrerfahrung haben wird. Kontaktieren Sie heute einen H.B. Fuller-Experten und Sie erfahren mehr über die weitere Entwicklung von Klebstoffen im Automobilbereich.

EA6031

  • Excellent plastic
  • PVC and PC bonding
  • Good gap flow
  • Viscosity: 300 cps
  • UV Cure Acrylic for Bonding PC Plastic Cell Carrier
Technologie Dokumentation
EA6031
Used For adhesion to plastics, metals and glass uv curable adhesive
Acrylic | UV Cure | UV Cure | UV Moisture Cure

EA6032

  • Excellent plastic
  • PVC and PC bonding
  • Viscosity: 3,000 cps
Technologie Dokumentation
EA6032
Used For adhesion to plastics, metals and glass
UV Cure | UV Moisture Cure

EA6033

  • Flexible and excellent plastic, PVC and PC bonding
  • Viscosity: 11,000 cps
  • 1 part PU UV cure bonding a wide variety of substrates
  • This product has shown excellent adhesion and flexible
  • It can be used for BGA reinforcement
Technologie Dokumentation
EA6033
Used For flexible and high adhesion on fpcb high quality uv cure adhesive for general bonding
Acrylic | UV Cure | UV Cure | UV Moisture Cure

EA6034

  • FPC reinforcement
  • Rigid material
  • Tacky free
  • Viscosity: 12,000 cps
Technologie Dokumentation
EA6034
Used For fpcb reinforcement
UV Cure | UV Moisture Cure

EA6035

  • Non-yellowing
  • High bonding strength for plastic
  • Viscosity: 4,000 cps
Technologie Dokumentation
EA6035
Used For fpcb reinforcement
UV Cure | UV Moisture Cure

EA6037

  • Electronics component reinforcement
  • Excellent adhesion on a wide range of materials
  • Viscosity: 20,000 cps
Technologie Dokumentation
EA6037
Used For component reinforcement fpcb reinforcement
UV Cure | UV Moisture Cure

EA6053H

  • Designed for rubber ring replacement
  • Soft material, Tacky free after cured
  • Viscosity: 30,000 cps, TI: 3
Technologie Dokumentation
EA6053H
Used For rubber ring replacement
UV Cure | UV Moisture Cure

EA6056

  • Designed for waterproof application
  • Soft material after cured
  • Tacky surface enhance sealant performance
  • Viscosity: 68,000 cps, TI: 4
Technologie Dokumentation
EA6056
Used For waterproof sealant
UV Cure | UV Moisture Cure

EA6107

  • UV/moisture cure conformal coating material
  • Medium viscosity
  • Viscosity: 10,500 cps
Technologie Dokumentation
EA6107
Used For pcb coating
UV Material | UV Moisture Cure

EA6110

  • Designed for circuit board protection
  • Viscosity: 800 cps
Technologie Dokumentation
EA6110
Used For pcb coating
UV Material | UV Moisture Cure

EA6111

  • Designed for circuit board protection
  • Low viscosity
  • Viscosity: 200 cps
Technologie Dokumentation
EA6111
Used For pcb coating
UV Material | UV Moisture Cure

EA6201

  • Excellent bonding perfromance
  • Shardow area cured by anaerobic
  • Viscosity: 18,000 cps
Technologie Dokumentation
EA6201
Used For adhesion to glass and metals anaerobic cure
UV Cure | UV Moisture Cure

EA6202

  • Excellent glass and metal bonding performance
  • Viscosity: 4,000 cps
Technologie Dokumentation
EA6202
Used For adhesion to glass and metals
UV Cure | UV Moisture Cure

EA6203

  • Excellent glass and metal bonding perfromance
  • Viscosity: 8,500 cps
Technologie Dokumentation
EA6203
Used For adhesion to glass and metals
UV Cure | UV Moisture Cure

EA6204

  • Designed for TN/STN end seal application
  • Viscosity: 10,000 cps
Technologie Dokumentation
EA6204
Used For adhesion to glass and metals tn/stn end seal
UV Cure | UV Moisture Cure

EA6205

  • Designed for TN/STN metal pin sealant
  • Viscosity: 7,000 cps
Technologie Dokumentation
EA6205
Used For adhesion to glass and metals tn/stn metal pin sealant
UV Cure | UV Moisture Cure

EA6206

  • Designed for TN/STN metal pin sealant
  • Viscosity: 14,000 cps
Technologie Dokumentation
EA6206
Used For adhesion to glass and metals tn/stn metal pin sealant
UV Cure | UV Moisture Cure

EA6402M

  • Designed for ISA (image sensor assembly) AA process
  • Black color
  • Dual cure system
  • UV plus low temperature cure (80℃)
  • Good initial strength by UV
  • High thermal bonding trength to LCP
  • Low shrinkage
  • Viscosity: 45,800 cps
Technologie Dokumentation
EA6402M
Used For aa process isa (image sensor assembly)
UV Material | UV Thermal Cure

EA6405

  • Designed for ISA (image sensor assembly) AA process
  • Beige color
  • Dual cure system
  • UV plus low temperature cure (65℃)
  • Good initial strength by UV
  • Low shrinkageViscosity: 48,000 cps
Technologie Dokumentation
EA6405
Used For aa process isa (image sensor assembly)
UV Material | UV Thermal Cure

EH9641

  • Ultra fast curing speed
Technologie Dokumentation
EH9641
Used For accessories assembly cell phone touch panel bonding structure assembly
Reactive Hotmelt | RHM

EH9650

  • General purpose
  • Excellent adhesion on most substrates
  • Capable of narrow edge bonding
  • Hot Melt excellent adhesion on most substrates without primer
Technologie Dokumentation
EH9650
Used For accessories assembly cell phone touch panel bonding reactive hotmelt with excellent adhesion on most substrates structure assembly
Reactive Hotmelt | RHM | RHM

EH9651B

  • Black color
  • Excellent adhesion on most substrates
  • Capable of narrow edge bonding
Technologie Dokumentation
EH9651B
Used For cell phone touch panel bonding
Reactive Hotmelt | RHM

EH9652

  • Excellent adhesion on PET, ABS and etc
  • High bonding strength
  • Capable of narrow edge bonding
Technologie Dokumentation
EH9652
Used For accessories assembly cell phone touch panel bonding structure assembly
Reactive Hotmelt | RHM

EH9672

  • High reliability and excellent reworkability
  • Excellent adhesion on most substrates
  • Long open time
Technologie Dokumentation
EH9672
Used For accessories assembly structure assembly tablet touch panel bonding
Reactive Hotmelt | RHM

EM9002

  • Low activation temperature
  • High strength and elongation
  • Good heat resistance
  • Good chemical resistance
  • Color: milky white
  • Recommended substrates: plastic, textiles - leather
  • Tacking temperature (°C): 45-55
  • Typical peel strength on polycarbonate
Technologie Dokumentation
EM9002
Used For leather plastic textiles
Film | Reactive film adhesive

EP702 (FH8516)

  • Room temperature curing epoxy adhesive
  • Designed for high strength
  • Good flexibility and good impact strength after curing
  • Good bonding performane on variable substrates including composite, metal, glass, ceramic
Technologie Dokumentation
EP702 (FH8516)
Used For structure bonding
2k Epoxy | 2k Epoxy

EU2002

  • Low odor
  • Excellent mech and chem resistance
Technologie Dokumentation
EU2002
Used For conformal coating
Solvent Base Modified Alkyd | Solvent-based

EU2002HV

  • Low odor
  • Excellent mech and chem resistance
  • High viscosity
Technologie Dokumentation
EU2002HV
Used For conformal coating
Solvent Base Modified Alkyd | Solvent-based

FH1007

  • Fast curing speed
  • Suitable for assembly application
  • It can be used in different substrates, such as metal, glass and most plastics
Technologie Dokumentation
FH1007
Used For moisture cure
Modified silicone | Modified silicone

FH1280AB

  • Compatible and good adhesion with Parylene
  • Excellent point and sharp edge coverage
  • Excellent mech and chem resistance
Technologie Dokumentation
FH1280AB
Used For conformal coating
2K PU | 2K PU

FH3911AB

  • Water/optically clear Low outgassing
Technologie Dokumentation
FH3911AB
Used For potting
2K Urethane | Urethane

FH4008AB

  • Excellent isolation resistance
  • Very low moisture absorption
  • Resistant to age hardening
  • Very high dielectric strength
  • High service temperature
Technologie Dokumentation
FH4008AB
Used For potting
2k Epoxy | Epoxy

FH7006FR

  • Excellent bonding performance on most substrates
  • Flammable retardant UL 94 V0
Technologie Dokumentation
FH7006FR
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7011

  • Metal structure bonding adhesive
  • 1 part acrylic anaerobic-Bonding ferrites to electro-plated materials in electric motors
Technologie Dokumentation
FH7011
Used For anaerobic adhesive for electric motor bonding structure bonding
1K Acrylate | Acrylate | Anaerobic | Anaerobic

FH7012

  • Thermal conductivity adhesive
Technologie Dokumentation
FH7012
Used For heat sink attachment
Acrylate | TCA

FH7012S

  • Thermal conductivity adhesive with Spacer
Technologie Dokumentation
FH7012S
Used For heat sink attachment
Acrylate | TCA

FH7013

  • High strength and impact resistance
  • High temperature resistance
  • Suitable for most of substrates
Technologie Dokumentation
FH7013
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7015

  • High strength and impact resistance
  • Suitable for most of substrates
Technologie Dokumentation
FH7015
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7016

  • Designed for special metal surfaces
  • High strength and impact resistant
Technologie Dokumentation
FH7016
Used For structure bonding
2K Acrylate | 2K Acrylate

FH7026

  • General purpose
  • High strength and impact resistance
  • Suitable for most of substrates
Technologie Dokumentation
FH7026
Used For structure bonding
2K Acrylate | 2K Acrylate

FH8009

  • Designed for high reliability portable devices
  • Fast flow performance
Technologie Dokumentation
FH8009
Used For underfill
Epoxy | Epoxy

FH8014

  • CSP/BGA high performance underfill
  • Very good reworkability
  • Substrate preheat is required
Technologie Dokumentation
FH8014
Used For underfill
Epoxy | Epoxy

FH8017M

  • Fast flow CSP underfill
  • Low temperature fast curing
  • Very good reworkability
Technologie Dokumentation
FH8017M
Used For underfill
Epoxy | Epoxy

FH8050

  • Designed for edge bonding application
  • Self-alignment in lead-free reflow
  • Good dispensing performance and shape retention
  • Capability in narrow edge CSP or WLCSP
Technologie Dokumentation
FH8050
Used For edge bonding
Epoxy | Epoxy

FH8301

  • Designed for Flipchip high reliability application
  • High Tg
  • Low CTE
  • High reliability
Technologie Dokumentation
FH8301
Used For underfill
Epoxy | Epoxy

FH8302

  • Designed for Flipchip high reliability application
  • High Tg
  • Low CTE
  • High reliability
  • High flowability
Technologie Dokumentation
FH8302
Used For underfill
Epoxy | Epoxy

FH8511

  • Excellent impact strength and toughness
  • Suitable for bonding most materials
  • Fast setting
Technologie Dokumentation
FH8511
Used For structure bonding
2k Epoxy | 2k Epoxy

FH8512

  • Medium fixture time
  • Suitable for most applications
Technologie Dokumentation
FH8512
Used For structure bonding
2k Epoxy | 2k Epoxy

FH8513

  • Designed for device assembly
  • Long open time
  • High reliability
  • High toughness
Technologie Dokumentation
FH8513
Used For structure bonding
2k Epoxy | 2k Epoxy

FH8515

  • Excellent impact strength and toughness
  • Suitable for bonding most materials
  • Flammable retardant UL 94 V0
  • Halogen free
Technologie Dokumentation
FH8515
Used For structure bonding
2k Epoxy | 2k Epoxy

FH8620

  • Low temperature and high bonding strength
  • Stencil printable
Technologie Dokumentation
FH8620
Used For structure bonding
Epoxy | LTCA

FH8621

  • Excellent toughness
  • Good jetting performance
  • Good bonding strength to PA and LCP
Technologie Dokumentation
FH8621
Used For image sensor house attachment
Epoxy | LTCA

FH8623

  • High performance material
  • Ultra fast curing
  • High toughness
  • Low shrinkage
Technologie Dokumentation
FH8623
Used For structure bonding
Epoxy | LTCA

FH8708T

  • Good dispensing performance and shape retention
  • Low CTE
  • Good reliability
Technologie Dokumentation
FH8708T
Used For edge bonding
Epoxy | Epoxy

FH8731

  • Designed for wirebond chip glob top
  • High flow material
Technologie Dokumentation
FH8731
Used For cob
Epoxy | Epoxy

FH8800

  • Optically clear bonding or LED die attach
Technologie Dokumentation
FH8800
Used For die attach potting or bonding
Epoxy | Epoxy

FH8801C

  • High electrical conductivity
  • High bond strength
  • Low stress
  • High Tg, Low CTE
  • Fast
  • Low temperature cure
  • Low outgassing
  • 1 part acrylate electrically conductive adhesive that cures by heat
  • Fast curing at low temperatures with outstanding bond strength
  • Used for chip bonding in microelectronic MEMS and optoelectronic applications
  • This material is able to snap cure during
Technologie Dokumentation
FH8801C
Used For conductive die attach fast curing chip bonding adhesive
Acrylate | Acrylic | ECA

FS3000

  • Good dielectric properties
  • Corrosion-free to metals
Technologie Dokumentation
FS3000
Used For conformal coating
1K silicone | Silicone

RFA1005

  • Excellent adhesion to metals
  • Low activation temperature
  • Color: milky white
  • Recommended substrates: stainless steel, aluminum, plastics, textiles, leather
  • Tacking temperature (°C): 45-55
  • Typical peel strength on polycarbonate (N/25 mm): 70-75
  • Typ
Technologie Dokumentation
RFA1005
Used For aluminum leather plastics stainless steel textiles
Film | Reactive film adhesive

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