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Understanding Underfill

Posted 12/13/2018 by Fei Xie, Ph.D. Senior Scientist, Microelectronics Packaging, Assembly, Reliability and Material

According to the Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022 report, the thermal management market is expected to grow at a CAGR of 7.91 percent with a total worth of $14.24 Billion USD by 2022. This market growth is likely due to a higher demand for smaller and lighter devices and an increased need f...

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