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H.B. Fuller to Highlight Unique Ecosystem Approach to Serving Electronics Industry at NEPCON 2014

April 17, 2014

Staying competitive in today’s electronics and assembly markets requires creating and commercializing innovative products fast. If you are attending NEPCON, April 23-25 in Shanghai, China, make sure to visit H.B. Fuller in Hall 1, Booth B-1D20, to learn how we can help you keep up with changing market demands and accelerate the product development life-cycle.

From automobiles to appliances and children’s toys to mobile phones, electronic applications just keep growing. The increasing demand for miniaturization, complexity of applications, and need to perform in harsher and more demanding environments is challenging manufacturers trying to move from “concept to customer” quickly.

H.B. Fuller understands these challenges. We offer differentiated bonding, sealing, coating and encapsulation solutions for high value electronic circuits and assemblies, and our “ecosystem” approach to serving customers is designed to help you be smarter, quicker and better at driving innovation.

We know adhesives don’t stop at holding components together; they must enhance performance, durability and aesthetics. They also must help to reduce assembly time and production costs. With more than 125 years of experience as a global adhesives innovator, we can provide proven expertise in reactive hot melt, thermoset film and epoxy technologies as well as advanced dispensing solutions. We are continually innovating new ways to meet your most difficult assembly challenges.

In addition to providing proven technology, H.B. Fuller works with your entire supply chain throughout the product development process – from ideation to prototype to manufacturing. This ecosystem approach, combined with our global reach, allows us to:

  • Consult at the ideation phase anywhere in the world;
  • Collaborate with supply chain partners to enable collective innovation;
  • Offer the right solutions at each step of the commercialization process;
  • Provide process expertise to your manufacturing partners to enable a smooth product launch and successful ongoing production.

In the fast changing world of electronics, new material challenges are constantly emerging, and by delivering superior timely solutions, we can sharpen your competitive advantage. Make sure to visit us at NEPCON to learn more about our total product and equipment solutions, and to discuss how our ecosystem approach to service can help you drive what’s next.

Not attending the show? Visit our web site or contact us today.

Zhiwei Cai
Director, Global Electronics

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