April 28, 2011
On May 12-18 at Interpack 2011 in Dusseldorf, H.B. Fuller will showcase our complete package of innovative adhesive technologies at Booth CO7 – Hall 7.2. This industry gathering provides an opportunity for the packaging market to see how our global capabilities help our customers improve their products and processes. Our years of experience and in-depth knowledge of the diverse packaging industry have allowed us to develop adhesives innovations to enhance the functionality of our customers’ packaging and to differentiate their products in a competitive market. Flagship products on display at Interpack include our new revolutionary Advantra EncoreTM adhesive, Advantra® hot melt packaging adhesives and the premier AdalisTM Open-Sesame® system.
Just introduced, Advantra EncoreTM is a new custom designed, proprietary technology platform that transforms hot melt performance. Surpassing the qualities of metallocene-based packaging adhesives, Advantra Encore sets a new standard for hot melt performance and supply. The combination of low density and superior bonding enables higher mileage in broader service temperature ranges with one adhesive product. And, it is available globally.
H.B. Fuller’s flagship range of advanced hot-melt adhesives for all packaging applications fall under the Advantra brand. Advantra hot melts deliver trouble free, superior performance and increased mileage versus traditional hot melt EVA adhesive products.
The Adalis Open-Sesame system complies with retail-ready packaging requirements. The clean-tearing feature enables retailers to create a display-ready tray with a reinforced edge without using box knives. The Open-Sesame system uses less board and maintains compression strength, resulting in better stackability and maximizing logistics efficiencies.
Other highlights at our booth include MasterBarTM, H.B. Fuller’s innovative adhesive format to enhance safety and convenience on the line and FlextraTM flexible packaging adhesives. Our portfolio of Flextra solventless and solvented laminating adhesives as well as Lunamelt® hot melt heat seal help reduce packaging materials, lower shipping costs and address environmental concerns.
Interpack is a big event for H.B. Fuller. It is an opportunity to exhibit some of our best products. As our customers seek improved efficiencies in their packaging production lines, we provide support by taking both cost and complications out of the process, using superior products that deliver great performance to improve our customers’ businesses. We’re looking forward to Interpack and to demonstrating how the right adhesive selection is an essential part of creative packaging solutions.
Contact us to learn more about H.B. Fuller’s global packaging capabilities and high performance adhesive solutions. We hope to see you at Interpack 2011.